Deposition of Cu seed layer film by supercritical fluid deposition for advanced interconnects

赵斌, 赵明涛, 张艳飞, 杨俊和

Zhao Bin (赵斌), Zhao Ming-Tao (赵明涛), Zhang Yan-Fei (张艳飞), Yang Jun-He (杨俊和)

中国物理B . 2013, (6): 64217 -064217 . DOI: 10.1088/1674-1056/22/6/064217