A novel analytical thermal model for multilevel nano-scale interconnects considering the via effect

朱樟明, 李儒, 郝报田, 杨银堂

Zhu Zhang-Ming(朱樟明),Li Ru(李儒), Hao Bao-Tian(郝报田), and Yang Yin-Tang(杨银堂)

中国物理B . 2009, (11): 4995 -5000 . DOI: 10.1088/1674-1056/18/11/063