Micro thermal shear stress sensor based on vacuum anodic bonding and bulk-micromachining
易亮, 欧毅, 石莎莉, 马瑾, 陈大鹏, 叶甜春
Micro thermal shear stress sensor based on vacuum anodic bonding and bulk-micromachining
Yi Liang(易亮), Ou Yi(欧毅), Shi Sha-Li(石莎莉), Ma Jin(马瑾), Chen Da-Peng(陈大鹏), and Ye Tian-Chun(叶甜春)
中国物理B
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2008, (6): 2130
-2136
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DOI: 10.1088/1674-1056/17/6/031