中国物理B ›› 2021, Vol. 30 ›› Issue (11): 118101-118101.doi: 10.1088/1674-1056/abff30

• • 上一篇    下一篇

Effect of nitrogen gas flow and growth temperature on extension of GaN layer on Si

Jian-Kai Xu(徐健凯)1,2,3,4, Li-Juan Jiang(姜丽娟)1,2,3,4,†, Qian Wang(王茜)1,2,3,4, Quan Wang(王权)1,5,6, Hong-Ling Xiao(肖红领)1,2,3,4, Chun Feng(冯春)1,2,3,4, Wei Li(李巍)1,2,3,4, and Xiao-Liang Wang(王晓亮)1,2,3,4   

  1. 1 Key Laboratory of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China;
    2 Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China;
    3 School of Microelectronics, University of Chinese Academy of Sciences, Beijing 100049, China;
    4 Beijing Key Laboratory of Low Dimensional Semiconductor Materials and Devices, Beijing 100083, China;
    5 The State Key Laboratory of Crystal Materials, Shandong University, Jinan 250100, China;
    6 Institute of Novel Semiconductors, Shandong University, Jinan 250100, China
  • 收稿日期:2021-03-19 修回日期:2021-04-15 接受日期:2021-05-08 出版日期:2021-10-13 发布日期:2021-11-06
  • 通讯作者: Li-Juan Jiang, Xiao-Liang Wang E-mail:ljjiang@semi.ac.cn;xlwang@semi.ac.cn
  • 基金资助:
    Project supported by the National Key Research and Development Program of China (Grant No. 2017YFB0402900) and the National Natural Sciences Foundation of China (Grant No. 62074144).

Effect of nitrogen gas flow and growth temperature on extension of GaN layer on Si

Jian-Kai Xu(徐健凯)1,2,3,4, Li-Juan Jiang(姜丽娟)1,2,3,4,†, Qian Wang(王茜)1,2,3,4, Quan Wang(王权)1,5,6, Hong-Ling Xiao(肖红领)1,2,3,4, Chun Feng(冯春)1,2,3,4, Wei Li(李巍)1,2,3,4, and Xiao-Liang Wang(王晓亮)1,2,3,4   

  1. 1 Key Laboratory of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China;
    2 Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China;
    3 School of Microelectronics, University of Chinese Academy of Sciences, Beijing 100049, China;
    4 Beijing Key Laboratory of Low Dimensional Semiconductor Materials and Devices, Beijing 100083, China;
    5 The State Key Laboratory of Crystal Materials, Shandong University, Jinan 250100, China;
    6 Institute of Novel Semiconductors, Shandong University, Jinan 250100, China
  • Received:2021-03-19 Revised:2021-04-15 Accepted:2021-05-08 Online:2021-10-13 Published:2021-11-06
  • Contact: Li-Juan Jiang, Xiao-Liang Wang E-mail:ljjiang@semi.ac.cn;xlwang@semi.ac.cn
  • Supported by:
    Project supported by the National Key Research and Development Program of China (Grant No. 2017YFB0402900) and the National Natural Sciences Foundation of China (Grant No. 62074144).

摘要: The effect of nitrogen flow and growth temperature on extension of GaN on Si substrate has been studied. By increasing the nitrogen flow whose outlet is located in the center of the MOCVD (metal-organic chemical vapor deposition) gas/particle screening flange and by increasing the growth temperature of HT-AlN and AlGaN buffer layers near the primary flat of the wafer, the GaN layer has extended more adequately on Si substrate. In the meantime, the surface morphology has been greatly improved. Both the AlN and GaN crystal quality uniformity has been improved. X-ray diffraction results showed that the GaN (0002) XRD FWHMs (full width at half maximum) decreased from 579 arcsec~ 1655 arcsec to around 420 arcsec.

关键词: GaN extension, MOCVD, nitrogen flow, growth temperature

Abstract: The effect of nitrogen flow and growth temperature on extension of GaN on Si substrate has been studied. By increasing the nitrogen flow whose outlet is located in the center of the MOCVD (metal-organic chemical vapor deposition) gas/particle screening flange and by increasing the growth temperature of HT-AlN and AlGaN buffer layers near the primary flat of the wafer, the GaN layer has extended more adequately on Si substrate. In the meantime, the surface morphology has been greatly improved. Both the AlN and GaN crystal quality uniformity has been improved. X-ray diffraction results showed that the GaN (0002) XRD FWHMs (full width at half maximum) decreased from 579 arcsec~ 1655 arcsec to around 420 arcsec.

Key words: GaN extension, MOCVD, nitrogen flow, growth temperature

中图分类号:  (III-V semiconductors)

  • 81.05.Ea
81.15.Gh (Chemical vapor deposition (including plasma-enhanced CVD, MOCVD, ALD, etc.)) 78.70.Dm (X-ray absorption spectra)