中国物理B ›› 2014, Vol. 23 ›› Issue (3): 38401-038401.doi: 10.1088/1674-1056/23/3/038401
• INTERDISCIPLINARY PHYSICS AND RELATED AREAS OF SCIENCE AND TECHNOLOGY • 上一篇 下一篇
刘晓贤, 朱樟明, 杨银堂, 王凤娟, 丁瑞雪
Liu Xiao-Xian (刘晓贤), Zhu Zhang-Ming (朱樟明), Yang Yin-Tang (杨银堂), Wang Feng-Juan (王凤娟), Ding Rui-Xue (丁瑞雪)
摘要: The through silicon via (TSV) technology has proven to be the critical enabler to realize a three-dimensional (3D) gigscale system with higher performance but shorter interconnect length. However, the received digital signal after transmission through a TSV channel, composed of redistribution layers (RDLs), TSVs, and bumps, is degraded at a high data-rate due to the non-idealities of the channel. We propose the Chebyshev multisection transformers to reduce the signal reflection of TSV channel when operating frequency goes up to 20 GHz, by which signal reflection coefficient (S11) and signal transmission coefficient (S21) are improved remarkably by 150% and 73.3%, respectively. Both the time delay and power dissipation are also reduced by 4% and 13.3%, respectively. The resistance-inductance-conductance-capacitance (RLGC) elements of the TSV channel are iterated from scattering (S)-parameters, and the proposed method of weakening the signal reflection is verified using high frequency simulator structure (HFSS) simulation software by Ansoft.
中图分类号: (Electronic circuits)