中国物理B ›› 2014, Vol. 23 ›› Issue (3): 38201-038201.doi: 10.1088/1674-1056/23/3/038201

• INTERDISCIPLINARY PHYSICS AND RELATED AREAS OF SCIENCE AND TECHNOLOGY • 上一篇    下一篇

Residual stress induced wetting variation on electric brush-plated Cu film

孟可可, 江月, 江忠浩, 连建设, 蒋青   

  1. Key Laboratory of Automobile Materials, Department of Materials Science and Engineering, Jilin University, Changchun 130025, China
  • 收稿日期:2013-07-04 修回日期:2013-11-08 出版日期:2014-03-15 发布日期:2014-03-15
  • 基金资助:
    Project supported by the National Natural Science Foundations of China (Grant No. 51371089) and the Foundation of National Key Basic Research and Development Program of China (Grant No. 2010CB 631001).

Residual stress induced wetting variation on electric brush-plated Cu film

Meng Ke-Ke (孟可可), Jiang Yue (江月), Jiang Zhong-Hao (江忠浩), Lian Jian-She (连建设), Jiang Qing (蒋青)   

  1. Key Laboratory of Automobile Materials, Department of Materials Science and Engineering, Jilin University, Changchun 130025, China
  • Received:2013-07-04 Revised:2013-11-08 Online:2014-03-15 Published:2014-03-15
  • Contact: Jiang Zhong-Hao E-mail:jzh@jlu.edu.cn
  • Supported by:
    Project supported by the National Natural Science Foundations of China (Grant No. 51371089) and the Foundation of National Key Basic Research and Development Program of China (Grant No. 2010CB 631001).

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摘要： Nanocrystalline Cu film with a mirror surface finishing is prepared by the electric brush-plating technique. The as-prepared Cu film exhibits a superhydrophilic behavior with an apparent water contact angle smaller than 10°. A subsequent increase in the water contact angle and a final wetting transition from inherent hydrophilicity with water contact angle smaller than 90° to apparent hydrophobicity with water contact angle larger than 90° are observed when the Cu film is subjected to natural aging. Analysis based on the measurement of hardness with nanoindentation and the theory of the bond-order-length-strength correlation reveals that this wetting variation on the Cu film is attributed to the relaxation of residual stress generated during brush-plating deposition and a surface hydrophobization role associated with the broken bond polarization induced by surface nanostructure.

关键词: superhydrophilicity, wetting transition, residual stress, nano indenter

Abstract: Nanocrystalline Cu film with a mirror surface finishing is prepared by the electric brush-plating technique. The as-prepared Cu film exhibits a superhydrophilic behavior with an apparent water contact angle smaller than 10°. A subsequent increase in the water contact angle and a final wetting transition from inherent hydrophilicity with water contact angle smaller than 90° to apparent hydrophobicity with water contact angle larger than 90° are observed when the Cu film is subjected to natural aging. Analysis based on the measurement of hardness with nanoindentation and the theory of the bond-order-length-strength correlation reveals that this wetting variation on the Cu film is attributed to the relaxation of residual stress generated during brush-plating deposition and a surface hydrophobization role associated with the broken bond polarization induced by surface nanostructure.

Key words: superhydrophilicity, wetting transition, residual stress, nano indenter

中图分类号:  (Surfactants, micellar solutions, vesicles, lamellae, amphiphilic systems, (hydrophilic and hydrophobic interactions))

  • 82.70.Uv
61.30.Hn (Surface phenomena: alignment, anchoring, anchoring transitions, surface-induced layering, surface-induced ordering, wetting, prewetting transitions, and wetting transitions) 83.85.St (Stress relaxation ?) 62.20.Qp (Friction, tribology, and hardness)