中国物理B ›› 2016, Vol. 25 ›› Issue (11): 114601-114601.doi: 10.1088/1674-1056/25/11/114601

• ELECTROMAGNETISM, OPTICS, ACOUSTICS, HEAT TRANSFER, CLASSICAL MECHANICS, AND FLUID DYNAMICS • 上一篇    下一篇

Molecular dynamics simulation of structural change at metal/semiconductor interface induced by nanoindenter

Bing-Bing Zhao(赵兵兵), Ying Wang(王影), Chang Liu(刘畅), Xiao-Chun Wang(王晓春)   

  1. 1 Institute of Atomic and Molecular Physics, Jilin University, Changchun 130012, China;
    2 Jilin Provincial Key Laboratory of Applied Atomic and Molecular Spectroscopy, Jilin University, Changchun 130012, China
  • 收稿日期:2016-01-16 修回日期:2016-05-27 出版日期:2016-11-05 发布日期:2016-11-05
  • 通讯作者: Xiao-Chun Wang E-mail:wangxiaochun@jlu.edu.cn
  • 基金资助:
    Project supported by the Tribology Science Fund of State Key Laboratory of Tribology, China (Grant No. SKLTKF12A01), the National Natural Science Foundation of China (Grant No. 11474123), the Natural Science Foundation of Jilin Province of China (Grant No. 20130101011JC), and the Fundamental Research Funds for Central Universities at Jilin University, China.

Molecular dynamics simulation of structural change at metal/semiconductor interface induced by nanoindenter

Bing-Bing Zhao(赵兵兵)1,2, Ying Wang(王影)1,2, Chang Liu(刘畅)1,2, Xiao-Chun Wang(王晓春)1,2   

  1. 1 Institute of Atomic and Molecular Physics, Jilin University, Changchun 130012, China;
    2 Jilin Provincial Key Laboratory of Applied Atomic and Molecular Spectroscopy, Jilin University, Changchun 130012, China
  • Received:2016-01-16 Revised:2016-05-27 Online:2016-11-05 Published:2016-11-05
  • Contact: Xiao-Chun Wang E-mail:wangxiaochun@jlu.edu.cn
  • Supported by:
    Project supported by the Tribology Science Fund of State Key Laboratory of Tribology, China (Grant No. SKLTKF12A01), the National Natural Science Foundation of China (Grant No. 11474123), the Natural Science Foundation of Jilin Province of China (Grant No. 20130101011JC), and the Fundamental Research Funds for Central Universities at Jilin University, China.

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摘要： The structures of the Si/Cu heterogenous interface impacted by a nanoindenter with different incident angles and depths are investigated in detail using molecular dynamics simulation. The simulation results suggest that for certain incident angles, the nanoindenter with increasing depth can firstly increase the stress of each atom at the interface and it then introduces more serious structural deformation of the Si/Cu heterogenous interface. A nanoindenter with increasing incident angle (absolute value) can increase the length of the Si or Cu extended atom layer. It is worth mentioning that when the incident angle of the nanoindenter is between -45° and 45°, these Si or Cu atoms near the nanoindenter reach a stable state, which has a lower stress and a shorter length of the Si or Cu extended atom layer than those of the other incident angles. This may give a direction to the planarizing process of very large scale integration circuits manufacture.

关键词: molecular dynamics, metal/semiconductor interface, reconstruction, nanoindenter

Abstract: The structures of the Si/Cu heterogenous interface impacted by a nanoindenter with different incident angles and depths are investigated in detail using molecular dynamics simulation. The simulation results suggest that for certain incident angles, the nanoindenter with increasing depth can firstly increase the stress of each atom at the interface and it then introduces more serious structural deformation of the Si/Cu heterogenous interface. A nanoindenter with increasing incident angle (absolute value) can increase the length of the Si or Cu extended atom layer. It is worth mentioning that when the incident angle of the nanoindenter is between -45° and 45°, these Si or Cu atoms near the nanoindenter reach a stable state, which has a lower stress and a shorter length of the Si or Cu extended atom layer than those of the other incident angles. This may give a direction to the planarizing process of very large scale integration circuits manufacture.

Key words: molecular dynamics, metal/semiconductor interface, reconstruction, nanoindenter

中图分类号:  (Tribology and mechanical contacts)

  • 46.55.+d
62.25.-g (Mechanical properties of nanoscale systems) 68.35.-p (Solid surfaces and solid-solid interfaces: structure and energetics)