Integrated physics package of a chip-scale atomic clock

doi:10.1088/1674-1056/23/7/074302

中国物理B ›› 2014, Vol. 23 ›› Issue (7): 74302-074302.doi: 10.1088/1674-1056/23/7/074302

• ELECTROMAGNETISM, OPTICS, ACOUSTICS, HEAT TRANSFER, CLASSICAL MECHANICS, AND FLUID DYNAMICS • 上一篇下一篇

Integrated physics package of a chip-scale atomic clock

李绍良^{a b}, 徐静^b, 张志强^{a b}, 赵璐冰^{a b}, 龙亮^{a b}, 吴亚明^a

a State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China;
b University of Chinese Academy of Sciences, Beijing 100049, China

收稿日期:2013-08-29 修回日期:2013-12-23 出版日期:2014-07-15 发布日期:2014-07-15
基金资助:
Project supported by the Knowledge Innovation Project of Chinese Academy of Sciences (Grant No. KGCX2-YW-143).

Integrated physics package of a chip-scale atomic clock

Li Shao-Liang (李绍良)^{a b}, Xu Jing (徐静)^b, Zhang Zhi-Qiang (张志强)^{a b}, Zhao Lu-Bing (赵璐冰)^{a b}, Long Liang (龙亮)^{a b}, Wu Ya-Ming (吴亚明)^a

a State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China;
b University of Chinese Academy of Sciences, Beijing 100049, China

Received:2013-08-29 Revised:2013-12-23 Online:2014-07-15 Published:2014-07-15
Contact: Wu Ya-Ming E-mail:yamingwu@mail.sim.ac.cn
About author:43.58.Hp; 32.80.Qk; 32.30.Bv; 85.30.De
Supported by:
Project supported by the Knowledge Innovation Project of Chinese Academy of Sciences (Grant No. KGCX2-YW-143).

摘要/Abstract

摘要： The physics package of a chip-scale atomic clock (CSAC) has been successfully realized by integrating vertical cavity surface emitting laser (VCSEL), neutral density (ND) filter, λ/4 wave plate, ⁸⁷Rb vapor cell, photodiode (PD), and magnetic coil into a cuboid metal package with a volume of about 2.8 cm³. In this physics package, the critical component, ⁸⁷Rb vapor cell, is batch-fabricated based on MEMS technology and in-situ chemical reaction method. Pt heater and thermistors are integrated in the physics package. A PTFE pillar is used to support the optical elements in the physics package, in order to reduce the power dissipation. The optical absorption spectrum of ⁸⁷Rb D1 line and the microwave frequency correction signal are successfully observed while connecting the package with the servo circuit system. Using the above mentioned packaging solution, a CSAC with short-term frequency stability of about 7× 10^-10τ^-1/2 has been successfully achieved, which demonstrates that this physics package would become one promising solution for the CSAC.

关键词: chip-scale atomic clock (CSAC), physics package, ⁸⁷Rb vapor cell, coherent population trapping (CPT)

Abstract: The physics package of a chip-scale atomic clock (CSAC) has been successfully realized by integrating vertical cavity surface emitting laser (VCSEL), neutral density (ND) filter, λ/4 wave plate, ⁸⁷Rb vapor cell, photodiode (PD), and magnetic coil into a cuboid metal package with a volume of about 2.8 cm³. In this physics package, the critical component, ⁸⁷Rb vapor cell, is batch-fabricated based on MEMS technology and in-situ chemical reaction method. Pt heater and thermistors are integrated in the physics package. A PTFE pillar is used to support the optical elements in the physics package, in order to reduce the power dissipation. The optical absorption spectrum of ⁸⁷Rb D1 line and the microwave frequency correction signal are successfully observed while connecting the package with the servo circuit system. Using the above mentioned packaging solution, a CSAC with short-term frequency stability of about 7× 10^-10τ^-1/2 has been successfully achieved, which demonstrates that this physics package would become one promising solution for the CSAC.

Key words: chip-scale atomic clock (CSAC), physics package, ⁸⁷Rb vapor cell, coherent population trapping (CPT)

中图分类号: (Tuning forks, frequency standards; frequency measuring and recording instruments; time standards and chronographs)

43.58.Hp

32.80.Qk (Coherent control of atomic interactions with photons) 32.30.Bv (Radio-frequency, microwave, and infrared spectra) 85.30.De (Semiconductor-device characterization, design, and modeling)

李绍良, 徐静, 张志强, 赵璐冰, 龙亮, 吴亚明. Integrated physics package of a chip-scale atomic clock[J]. 中国物理B, 2014, 23(7): 74302-074302.

Li Shao-Liang (李绍良), Xu Jing (徐静), Zhang Zhi-Qiang (张志强), Zhao Lu-Bing (赵璐冰), Long Liang (龙亮), Wu Ya-Ming (吴亚明). Integrated physics package of a chip-scale atomic clock[J]. Chin. Phys. B, 2014, 23(7): 74302-074302.

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Integrated physics package of a chip-scale atomic clock

Integrated physics package of a chip-scale atomic clock

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