中国物理B ›› 2010, Vol. 19 ›› Issue (9): 97202-097202.doi: 10.1088/1674-1056/19/9/097202

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A new model for electromigration grain boundary noise based on free volume

庄奕琪1, 何亮2, 杜磊2, 陈华2, 陈文豪2, 李伟华2, 孙鹏2   

  1. (1)School of Microelectronics, Xidian University, Xi'an 710071, China; (2)School of Technical Physics, Xidian University, Xi'an 710071, China
  • 收稿日期:2010-01-15 修回日期:2010-04-01 出版日期:2010-09-15 发布日期:2010-09-15
  • 基金资助:
    Project supported by the National Natural Science Foundation of China (Grant No. 60376023) and the Innovative Foundation of Xi'an Applied Materials Inc. China (Grant No. XA-AM-200603).

A new model for electromigration grain boundary noise based on free volume

He Liang(何亮)a)†, Du Lei(杜磊)a), Zhuang Yi-Qi(庄奕琪)b), Chen Hua(陈华)a), Chen Wen-Hao(陈文豪)a), Li Wei-Hua(李伟华)a), and Sun Peng(孙鹏)a)   

  1. a School of Technical Physics, Xidian University, Xi'an 710071, China; b School of Microelectronics, Xidian University, Xi'an 710071, China
  • Received:2010-01-15 Revised:2010-04-01 Online:2010-09-15 Published:2010-09-15
  • Supported by:
    Project supported by the National Natural Science Foundation of China (Grant No. 60376023) and the Innovative Foundation of Xi'an Applied Materials Inc. China (Grant No. XA-AM-200603).

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摘要： Grain boundary plays a key role in electromigration process of polycrystal interconnection. We take a free volume to represent a 'vacancy--ion complex' as a function of grain boundary specific resistivity, and develop a new characterisation model for grain boundary noise. This model reveals the internal relation between the boundary scattering section and electromigration noise. Comparing the simulation result with our experimental result, we find the source as well as the form of noise change in the electromigration process. In order to describe the noise enhancement at grain boundary quantitatively, we propose a new parameter—grain boundary noise enhancement factor, which reflects that the grain boundary noise can characterise the electromigration damage sensitively.

Abstract: Grain boundary plays a key role in electromigration process of polycrystal interconnection. We take a free volume to represent a 'vacancy–ion complex' as a function of grain boundary specific resistivity, and develop a new characterisation model for grain boundary noise. This model reveals the internal relation between the boundary scattering section and electromigration noise. Comparing the simulation result with our experimental result, we find the source as well as the form of noise change in the electromigration process. In order to describe the noise enhancement at grain boundary quantitatively, we propose a new parameter——grain boundary noise enhancement factor, which reflects that the grain boundary noise can characterise the electromigration damage sensitively.

Key words: free volume, electromigration, grain boundary noise

中图分类号: 

  • 7270