中国物理B ›› 2006, Vol. 15 ›› Issue (1): 195-198.doi: 10.1088/1009-1963/15/1/031
孙宝刚1, 马晓华2, 郝跃2, 高海霞2, 任红霞2, 张进城2, 张金凤2, 张晓菊2, 张卫东3
Ma Xiao-Hua (马晓华)ab, Hao Yue (郝跃)ab, Sun Bao-Gang (孙宝刚)c, Gao Hai-Xia (高海霞)ab, Ren Hong-Xia (任红霞)ab, Zhang Jin-Cheng (张进城)ab, Zhang Jin-Feng (张金凤)ab, Zhang Xiao-Ju (张晓菊)ab, Zhang Wei-Dong (张卫东)d
摘要: N and P-channel groove-gate MOSFETs based on a self-aligned CMOS process have been fabricated and characterized. For the devices with channel length of 140nm, the measured drain induced barrier lowering (DIBL) was 66mV/V for n-MOSFETs and 82mV/V for p-MOSFETs. The substrate current of a groove-gate n-MOSFET was 150 times less than that of a conventional planar n-MOSFET. These results demonstrate that groove-gate MOSFETs have excellent capabilities in suppressing short-channel effects. It is worth emphasizing that our groove-gate MOSFET devices are fabricated by using a simple process flow, with the potential of fabricating devices in the sub-100nm range.
中图分类号: (Field effect devices)