Print ISSN:1674-1056  |  Online ISSN:2058-3834  |  CN:11-5639/O4
  • Cite this article:

    Xuanye Liu, Linxuan Li, Chijun Wei, Peng Song, Hui Gao, Kang Wu, Nuertai Jiazila, Jiequn Sun, Hui Guo, Haitao Yang, Wu Zhou, Lihong Bao, Hong-Jun Gao. A universal resist-assisted metal transfer method for 2D semiconductor contactsJ. Chin. Phys. B, 2024, 33(12): 127302.
    Xuanye Liu, Linxuan Li, Chijun Wei, Peng Song, Hui Gao, Kang Wu, Nuertai Jiazila, Jiequn Sun, Hui Guo, Haitao Yang, Wu Zhou, Lihong Bao, Hong-Jun Gao. A universal resist-assisted metal transfer method for 2D semiconductor contactsJ. Chin. Phys. B, 2024, 33(12): 127302.
  • A universal resist-assisted metal transfer method for 2D semiconductor contacts

    • With the explosive exploration of two-dimensional (2D) semiconductors for device applications, ensuring effective electrical contacts has become critical for optimizing device performance. Here, we demonstrate a universal resist-assisted metal transfer method for creating nearly free-standing metal electrodes on the SiO2/Si substrate, which can be easily transferred onto 2D semiconductors to form van der Waals (vdW) contacts. In this method, polymethyl methacrylate (PMMA) serves both as an electron resist for electrode patterning and as a sacrificial layer. Contacted with our transferred electrodes, MoS2 exhibits tunable Schottky barrier heights and a transition from n-type dominated to ambipolar conduction with increasing metal work functions, while InSe shows pronounced ambipolarity. Additionally, using α-In2Se3 as an example, we demonstrate that our transferred electrodes enhance resistance switching in ferroelectric memristors. Finally, the universality of our method is evidenced by the successful transfer of various metals with different adhesion forces and complex patterns.
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