Print ISSN:1674-1056  |  Online ISSN:2058-3834  |  CN:11-5639/O4
  • Cite this article:

    Yuefei Cai, Jie Bai, Tao Wang. Review of a direct epitaxial approach to achieving micro–LEDsJ. Chin. Phys. B, 2023, 32(1): 018508.
    Yuefei Cai, Jie Bai, Tao Wang. Review of a direct epitaxial approach to achieving micro–LEDsJ. Chin. Phys. B, 2023, 32(1): 018508.
  • Review of a direct epitaxial approach to achieving micro–LEDs

    • There is a significantly increasing demand of developing augmented reality and virtual reality (AR and VR) devices, where micro-LEDs (μLEDs) with a dimension of ≤ 5 μm are the key elements. Typically, μLEDs are fabricated by dry-etching technologies, unavoidably leading to a severe degradation in optical performance as a result of dry-etching induced damages. This becomes a particularly severe issue when the dimension of LEDs is ≤ 10 μm. In order to address the fundamental challenge, the Sheffield team has proposed and then developed a direct epitaxial approach to achieving μLEDs, where the dry-etching technologies for the formation of μLED mesas are not needed anymore. This paper provides a review on this technology and then demonstrates a number of monolithically integrated devices on a single chip using this technology.
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