Research of photolithography technology based on surface plasmon

This paper demonstrates a new process of the photolithography technology, used to fabricate simply fine patterns, by employing surface plasmon character. The sub-wavelength periodic silica structures with uniform silver film are used as the exposure mask. According to the traditional semiconductor process, the grating structures are fabricated at exposing wavelength of 436 nm. At the same time, it provides additional and quantitative support of this technique based on the finite-difference time-domain method. The results of the research show that surface plasmon characteristics of metals can be used to increase the optical field energy distribution differences through the silica structures with silver film, which directly impact on the exposure of following photosensitive layer in different regions.