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  • Cite this article:

    Jun Luo, Sheng-Lei Zhao, Min-Han Mi, Wei-Wei Chen, Bin Hou, Jin-Cheng Zhang, Xiao-Hua Ma, Yue Hao. Effect of gate length on breakdown voltage in AlGaN/GaN high-electron-mobility transistorJ. Chin. Phys. B, 2016, 25(2): 027303.
    Jun Luo, Sheng-Lei Zhao, Min-Han Mi, Wei-Wei Chen, Bin Hou, Jin-Cheng Zhang, Xiao-Hua Ma, Yue Hao. Effect of gate length on breakdown voltage in AlGaN/GaN high-electron-mobility transistorJ. Chin. Phys. B, 2016, 25(2): 027303.
  • Effect of gate length on breakdown voltage in AlGaN/GaN high-electron-mobility transistor

    • The effects of gate length LG on breakdown voltage VBR are investigated in AlGaN/GaN high-electron-mobility transistors (HEMTs) with LG = 1 μm~ 20 μm. With the increase of LG, VBR is first increased, and then saturated at LG=3 μm. For the HEMT with LG=1 μm, breakdown voltage VBR is 117 V, and it can be enhanced to 148 V for the HEMT with LG = 3 μm. The gate length of 3 μm can alleviate the buffer-leakage-induced impact ionization compared with the gate length of 1 μm, and the suppression of the impact ionization is the reason for improving the breakdown voltage. A similar suppression of the impact ionization exists in the HEMTs with LG>3 μm. As a result, there is no obvious difference in breakdown voltage among the HEMTs with LG = 3 μm~ 20 μm, and their breakdown voltages are in a range of 140 V-156 V.
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