Cite this article:
Huang Jingfeng, Melanie Larisika, Chen Hu, Steve Faulkner, Myra A. Nimmo, Christoph Nowak, Alfred Tok Iing Yoong. Complete coverage of reduced graphene oxide on silicon dioxide substratesJ. Chin. Phys. B, 2014, 23(8): 088104.
| Huang Jingfeng, Melanie Larisika, Chen Hu, Steve Faulkner, Myra A. Nimmo, Christoph Nowak, Alfred Tok Iing Yoong. Complete coverage of reduced graphene oxide on silicon dioxide substratesJ. Chin. Phys. B, 2014, 23(8): 088104. |
Complete coverage of reduced graphene oxide on silicon dioxide substrates
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Abstract
Reduced graphene oxide (RGO) has the advantage of an aqueous and industrial-scale production route. No other approaches can rival the RGO field effect transistor platform in terms of cost (< US1) and portability (millimetre scale). However the large deviations in the electrical resistivity of this fabricated material prevent it from being used widely. After an ethanol chemical vapor deposition (CVD) post-treatment to graphene oxide with ethanol, carbon islets are deposited preferentially at the edges of existing flakes. With a 2-h treatment, the standard deviation in electrical resistance of the treated chips can be reduced by 99.95%. Thus this process could enable RGO to be used in practical electronic devices. -
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