Cite this article:
Huang Jie, Li Ming, Tang Chak-Wah, Lau Kei-May. Lg=100 nm T-shaped gate AlGaN/GaN HEMTs on Si substrates with non-planar source/drain regrowth of highly-doped n+-GaN layer by MOCVDJ. Chin. Phys. B, 2014, 23(12): 128102.
| Huang Jie, Li Ming, Tang Chak-Wah, Lau Kei-May. Lg=100 nm T-shaped gate AlGaN/GaN HEMTs on Si substrates with non-planar source/drain regrowth of highly-doped n+-GaN layer by MOCVDJ. Chin. Phys. B, 2014, 23(12): 128102. |
Lg=100 nm T-shaped gate AlGaN/GaN HEMTs on Si substrates with non-planar source/drain regrowth of highly-doped n+-GaN layer by MOCVD
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Abstract
High-performance AlGaN/GaN high electron mobility transistors (HEMTs) grown on silicon substrates by metal–organic chemical-vapor deposition (MOCVD) with a selective non-planar n-type GaN source/drain (S/D) regrowth are reported. A device exhibited a non-alloyed Ohmic contact resistance of 0.209 Ω·mm and a comprehensive transconductance (gm) of 247 mS/mm. The current gain cutoff frequency fT and maximum oscillation frequency fMAX of 100-nm HEMT with S/D regrowth were measured to be 65 GHz and 69 GHz. Compared with those of the standard GaN HEMT on silicon substrate, the fT and fMAX is 50% and 52% higher, respectively. -
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