Cite this article:
Qin Xi-Feng, Li Hong-Zhen, Li Shuang, Ji Zi-Wu, Wang Hui-Ning, Wang Feng-Xiang, Fu Gang. Investigation of the inhibiting outdiffusion of erbium atoms to a silicon-on-insulator surface after annealing at high temperatureJ. Chin. Phys. B, 2012, 21(6): 066105.
| Qin Xi-Feng, Li Hong-Zhen, Li Shuang, Ji Zi-Wu, Wang Hui-Ning, Wang Feng-Xiang, Fu Gang. Investigation of the inhibiting outdiffusion of erbium atoms to a silicon-on-insulator surface after annealing at high temperatureJ. Chin. Phys. B, 2012, 21(6): 066105. |
Investigation of the inhibiting outdiffusion of erbium atoms to a silicon-on-insulator surface after annealing at high temperature
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Abstract
The annealing behaviour of 400 keV Er ions at a fluence of 2 × 1015 cm-2 implanted into silicon-on-insulator (SOI) samples is investigated by Rutherford backscattering spectrometry of 2.1 MeV He2+ ions with a multiple scattering model. It is found that the damage close to the SOI surface is almost removed after being annealed in O2 and N2 atmospheres, successively, at 900 ℃, and that only a small number of the Er atoms segregated to the surface of the SOI sample, whereas a large number of Er atoms diffused to a deeper position because of the affinity of Er for oxygen. For the SOI sample co-implanted with Er and O ions, there is no evident outdiffusion of Er atoms to the SOI surface after being annealed in N2 atmosphere at 900 ℃. -
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