Cite this article:
Wang Shou-Guo, Zhang Yan, Zhang Yi-Men, Zhang Yu-Ming. Ohmic contacts of 4H-SiC on ion-implantation layersJ. Chin. Phys. B, 2010, 19(1): 017204.
| Wang Shou-Guo, Zhang Yan, Zhang Yi-Men, Zhang Yu-Ming. Ohmic contacts of 4H-SiC on ion-implantation layersJ. Chin. Phys. B, 2010, 19(1): 017204. |
Ohmic contacts of 4H-SiC on ion-implantation layers
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Abstract
The ohmic contacts of 4H-SiC are fabricated on nitrogen ion implanted layers made by performing box-like-profile implantation three and four times. Implantation parameters such as the standard deviation σ and the projection range Rp are calculated by the Monte Carlo simulator TRIM. Ni/Cr ohmic contacts on Si-face 4H-SiC implantation layers are measured by transfer length methods (TLMs). The results show that the values of sheet resistance Rsh are 30 kΩ /□ and 4.9 kΩ/□ and the values of specific contact resistance \rho_\rm c of ohmic contacts are 7.1× 10-4 Ω\cdotcm2 and 9.5 × 10-5Ω \cdot cm2 for the implanted layers with implantation performed three and four times respectively. -
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