Improvement of electrical properties of Cu/SiCOH low-k film integrated system by O₂ plasma treatment

This paper investigates the effect of O₂ plasma treatment on the electric property of Cu/SiCOH low dielectric constant (low-k) film integrated structure. The results show that the leakage current of Cu/SiCOH low-k integrated structure can be reduced obviously at the expense of a slight increase in dielectric constant k of SiCOH films. By the Fourier transform infrared (FTIR) analysis on the bonding configurations of SiCOH films treated by O₂ plasma, it is found that the decrease of leakage current is related to the increase of Si-O cages originating from the linkage of Si dangling bonds through O, which makes the open pores sealed and reduces the diffusion of Cu to pores.