Pyrosol process for deposition of fluorine-doped tin dioxide thin films

Transparent low-resistance SnO_2:F films, suitable as a low-emissivity and conducting coating, have been deposited on silica-coated soda lime glass substrates by pyrosol process. SnCl_4\cdot 5H_2O and NH_4F dissolved in solvent of 50% C_2H_5OH/50% H_2O served as the starting solution. With the parameters such as substrate temperature of 450^\circC, distance between the nozzle and substrate of 60mm, carrier gas flow rate of 8L/min and deposition time of 5min, the optimized SnO_2:F films having a sheet resistance of about 2\Omega/\Box, were deposited repeatedly. The relationship between sheet resistances and infrared transmission spectra of SnO_2:F films is shown schematically.