Beryllium carbide as diffusion barrier against Cu: First-principles study<xref rid="cpb_29_1_016601fn1" ref-type="fn">*</xref><fn id="cpb_29_1_016601fn1"><label>*</label><p>Project supported by the National Natural Science Foundation of China (Grant Nos. 11974253 and 11774248) and the National Key Technology Research and Development Program of the Ministry of Science and Technology of China (Grant No. 2017YFA0303600).</p></fn>

Beryllium carbide as diffusion barrier against Cu: First-principles study**

Project supported by the National Natural Science Foundation of China (Grant Nos. 11974253 and 11774248) and the National Key Technology Research and Development Program of the Ministry of Science and Technology of China (Grant No. 2017YFA0303600).

Cao Hua-Liang¹, Cheng Xin-Lu^{1, 2}, Zhang Hong^{1, 2, †}

The diffusion barrier of copper atoms as they pass through the Be₂C-III monolayer and the monolayer is placed in the crystal of beryllium: (a) Be₂C-III monolayer, (b) the Be₂C-III monolayer in the crystal of beryllium.