Heat transfer of liquid metal alloy on copper plate deposited with film of different surface free energy<xref rid="cpb_28_11_114401fn1" ref-type="fn">*</xref><fn id="cpb_28_11_114401fn1"><label>*</label><p>Project supported by the National Natural Science Foundation of China (Grant No. 11874191) and the Natural Science Foundation of Shandong Province, China (Grant No. ZR2016FM38).</p></fn>

Heat transfer of liquid metal alloy on copper plate deposited with film of different surface free energy**

Project supported by the National Natural Science Foundation of China (Grant No. 11874191) and the Natural Science Foundation of Shandong Province, China (Grant No. ZR2016FM38).

Yan Huilong^{1, †}, Yan Jinliang^{2, ‡}, Zhao Gang²

Contact angle of diiodomethane on filmed Cu plate: (a) Ag coating (64.6°), (b) Ti coating (43.4°), (c) Cu coating (41.8°), (d) Ni coating (36.8°), (e) Mo coating (29.3°), (f) W coating (19.1°).