Thermal resistance matrix representation of thermal effects and thermal design of microwave power HBTs with two-dimensional array layout

Chen Rui, Jin Dong-Yue^†, Zhang Wan-Rong, Wang Li-Fan, Guo Bin, Chen Hu, Yin Ling-Han, Jia Xiao-Xue

The peak junction temperature profiles at heat source surface of HBTs array with uniform cell spacing (array-1) and HBTs array with varying cell spacing (array-2) at V CE = 7 V .