Thermal resistance matrix representation of thermal effects and thermal design of microwave power HBTs with two-dimensional array layout
Chen Rui, Jin Dong-Yue †, Zhang Wan-Rong, Wang Li-Fan, Guo Bin, Chen Hu, Yin Ling-Han, Jia Xiao-Xue
       

Profile of thermal resistance matrix [Rijkl] (K/W) in the 2 × 6 HBTs array with non-uniform Sx and non-uniform Sy (array-2) at IC of 2.4 mA and VCE of 5 V.