Thermal conductivity characterization of ultra-thin silicon film using the ultra-fast transient hot strip method
Zhang Yan-Yan1, Cheng Ran1, Ni Dong2, Tian Ming3, Lu Ji-Wu4, †, Zhao Yi1
       

The cross-plane thermal conductivity extracted at temperatures (a) from 300 K to 400 K, and (b) from 75 K to 285 K.