Effect of substrate type on Ni self-assembly process*

Project supported by the National Natural Science Foundation of China (Grant Nos. 61473266 and 61673404), the Program for Science&Technology Innovation Talents in Universities of Henan Province, China (Grant No. 16HASTIT033), the Science and Technique Foundation of Henan Province, China (Grant Nos. 132102210521, 152102210153, 182102210516, and 172102210601), the Key Program in Universities of Henan Province, China (Grant No. 17B520044), and the Science and Technique Project of the China National Textile and Apparel Council (Grant No. 2018104).

Chai Xuzhao1, †, Qu Boyang1, ‡, Jiao Yuechao1, Liu Ping1, Ma Yanxia1, Wang Fengge1, Li Xiaoquan1, Fang Xiangqian1, Han Ping2, Zhang Rong2
       

SEM images of the Ni film on sapphire (0001) after annealing at different temperatures: (a) 700 °C, (b) 750 °C, (c) 800 °C, (d) 850 °C, (e) 900 °C.