Effect of different bending shapes on thermal properties of flexible light-emitting diode filament Project supported by the National Natural Science Foundation of China (Grant No. 51302171), Science and Technology Commission of Shanghai Municipality, China (Grant No. 14500503300), Shanghai Municipal Alliance Program, China (Grant No. Lm201547), Shanghai Cooperative Project, China (Grant No. ShanghaiCXY-2013-61), and Jiashan County Technology Program, China (Grant No. 20141316). |
(a) Solder, (b) chip, (c) substrate, and (d) phosphor layer. |