Key technologies for dual high-<i>k</i> and dual metal gate integration<xref rid="cpb_27_9_097306fn1" ref-type="fn">*</xref><fn id="cpb_27_9_097306fn1"><label>*</label><p>Project supported by the National High Technology Research and Development Program of China (Grant No. 2015AA010601).</p></fn>

Key technologies for dual high-k and dual metal gate integration**

Project supported by the National High Technology Research and Development Program of China (Grant No. 2015AA010601).

Li Yong-Liang^†, Xu Qiu-Xia, Wang Wen-Wu

SEM image of (a) TaN and (b) TaN/Mo synchronously etched by optimized BCl₃/SF₆/O₂/Ar plasma in MIPS structure for DHDMG process.