Progressive current degradation and breakdown behavior in GaN LEDs under high reverse bias stress
Zhao Linna1, Yu Peihong1, Guo Zixiang3, Yan Dawei1, †, Zhou Hao1, Wu Jinbo1, Cui Zhiqiang1, Sun Huarui2, Gu Xiaofeng1, ‡
       

(color online) (a) The current evolution during the step-stress experiments of the GaN-based LEDs, and (b) the catastrophic failure process as a function of time at a high reverse bias of -40 V. The inset shows the spatial distribution of the EL spots before and after device failure.