Design and characterization of a 3D encapsulation with silicon vias for radio frequency micro-electromechanical system resonator

Zhao Ji-Cong^{1, 3}, Yuan Quan¹, Wang Feng-Xiang^{1, 4}, Kan Xiao^{1, 4}, Han Guo-Wei¹, Sun Ling³, Sun Hai-Yan³, Yang Jin-Ling^{1, 2, 4, †}, Yang Fu-Hua^{1, 2}

(color online) Fabrication process flow of the encapsulation cap.