Design and characterization of a 3D encapsulation with silicon vias for radio frequency micro-electromechanical system resonator
Zhao Ji-Cong1, 3, Yuan Quan1, Wang Feng-Xiang1, 4, Kan Xiao1, 4, Han Guo-Wei1, Sun Ling3, Sun Hai-Yan3, Yang Jin-Ling1, 2, 4, †, Yang Fu-Hua1, 2
       

(color online) Schematic view and via-to-via coupling models of proposed cap structures: (a) without shielding and (b) with coaxial shielding.