Modeling and understanding of the thermal failure induced by high power microwave in CMOS inverter

Zhang Yu-Hang^†, Chai Chang-Chun, Liu Yang, Yang Yin-Tang, Shi Chun-Lei, Fan Qing-Yang, Liu Yu-Qian

(color online) Distributions of (a) current density, (b) electric field strength, and (c) temperature during positive semi-period of external microwave inside the device.