Crystallization behaviors of ultrathin Al-doped HfO2 amorphous films grown by atomic layer deposition
Ma Xue-Li1, 3, Yang Hong1, 3, Xiang Jin-Juan1, 3, Wang Xiao-Lei1, 3, Wang Wen-Wu1, 3, †, Zhang Jian-Qi2, Yin Hua-Xiang1, 3, Zhu Hui-Long1, 3, Zhao Chao1, 3
       

(color online) The C−V curves of MOS capacitors with 4-nm Al-doped HfO2 film and different-thickness SiO2 films as dielectric films annealed at (a) 550 °C, (b) 650 °C, and (c) 750 °C.