Effect of PECVD SiNx/SiOyNx–Si interface property on surface passivation of silicon wafer
Jia Xiao-Jie1, Zhou Chun-Lan1, †, , Zhu Jun-Jie2, Zhou Su1, Wang Wen-Jing1
       

Multifrequency (10 kHz to 1 MHz) CGV characteristics of an MIS capacitor utilizing post-RTA SiOyNx/SiNx stacks. (a) The CV curves were measured in inversion–accumulation direction. (b) The peaks of G/ωV curves lie in the range of depletion.