Parasitic effects of air-gap through-silicon vias in high-speed three-dimensional integrated circuits
Liu Xiaoxian, Zhu Zhangming†, 
, Yang Yintang, Ding Ruixue, Li Yuejin
, Yang Yintang, Ding Ruixue, Li Yuejin Cross-sectional view of the GSG-type TSV structure with structural parameters.
