Thermal effect on endurance performance of 3-dimensional RRAM crossbar array
Lu Nianduan1, 2, †, 
, Sun Pengxiao1, 2, †, , Li Ling1, 2, ‡, , Liu Qi1, 2, Long Shibing1, 2, Hangbing Lv1, 2, Liu Ming1, 2
, Sun Pengxiao1, 2, †, , Li Ling1, 2, ‡, , Liu Qi1, 2, Long Shibing1, 2, Hangbing Lv1, 2, Liu Ming1, 2 Schematics of the 1D1R cell with continuously scaling down the feature size. Electrode component (colored in brown) between the RRAM and diode cells will become filamentous.
