Detection and formation mechanism of micro-defects in ultrafine pitch Cu

Detection and formation mechanism of micro-defects in ultrafine pitch Cu—Cu direct bonding

Liu Zi-Yu¹, Cai Jian^{1, 2, †,}, Wang Qian¹, Chen Yu¹

Schematic diagrams of surface topology after CMP process of (a) copper in protrusion, (c) flat surface, and (e) copper in dishing. Possible bonding models at the interface of (b) copper in protrusion, (d) flat surface, and (f) copper in dishing.