Detection and formation mechanism of micro-defects in ultrafine pitch Cu

Detection and formation mechanism of micro-defects in ultrafine pitch Cu—Cu direct bonding

Liu Zi-Yu¹, Cai Jian^{1, 2, †,}, Wang Qian¹, Chen Yu¹

Defect recovery processes observed (a) before annealing and cooling, (b) immediately after annealing and cooling, (c) after 38 hours, (d) after 64 hours, (e) after 84 hours, and (f) after 182 hours.