Detection and formation mechanism of micro-defects in ultrafine pitch Cu

Detection and formation mechanism of micro-defects in ultrafine pitch Cu—Cu direct bonding

Liu Zi-Yu¹, Cai Jian^{1, 2, †,}, Wang Qian¹, Chen Yu¹

The c-SAM images for sliced dies after the direct bonding process: (a) as-bonded, (b) after annealing and quick cooling.