Detection and formation mechanism of micro-defects in ultrafine pitch Cu—Cu direct bonding
Liu Zi-Yu1, Cai Jian1, 2, †, 
, Wang Qian1, Chen Yu1
, Wang Qian1, Chen Yu1 Interface morphologies observation by SEM for the pitches of (a) 15 μm, (b) 8 μm, (c) 6 μm, and (d) seams near the bonded Cu pad.
