Transient thermal analysis as measurement method for IC package structural integrity
Hanß Alexander, Schmid Maximilian, Liu E, Elger Gordon†
Transient thermal analysis as measurement method for IC package structural integrity |
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Hanß Alexander, Schmid Maximilian, Liu E, Elger Gordon†
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| Under identical test conditions with the same set-up and device under test (DUT), three different TIMs were used. The black line displays the test with a half-liquid heat transfer paste as TIM, the red line stands for the measurements with a plastic foil TIM with a low thermal conductivity, and the blue line displays a TIM in the form of a pad with high thermal conductivity and a thickness of 0.5 mm. |
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