Transient thermal analysis as measurement method for IC package structural integrity
Hanß Alexander, Schmid Maximilian, Liu E, Elger Gordon†
Transient thermal analysis as measurement method for IC package structural integrity |
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Hanß Alexander, Schmid Maximilian, Liu E, Elger Gordon†
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| Transient temperature measurement of a ceramic LED package using an MICRED T3Ster. The cable length of the drive source to the LED is varied in an extreme way (short = 10 cm, long = 2 m) resulting in different thermal loads for the same drive current. The electric load in the cables is not subtracted, i.e., the software assumes that the full electrical load is dissipated in the LED and calculates different R th_el structural functions, i.e., a smaller R th_el for the long cable. However, the time-derived curves are identical, as the same amount of thermal load is dissipated in the LED. |
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