Transient thermal analysis as measurement method for IC package structural integrity
Hanß Alexander, Schmid Maximilian, Liu E, Elger Gordon†
Transient thermal analysis as measurement method for IC package structural integrity |
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Hanß Alexander, Schmid Maximilian, Liu E, Elger Gordon†
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| Normalization of wrong k -factor: The same ceramic LED module is measured with a MICRED T3Ster but different k -factors are used, i.e. the k -factor of 2.5, simulating a measurement error of the k -factor. It is readily apparent that the influence of the k -factor can be eliminated. |
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