Transient thermal analysis as measurement method for IC package structural integrity
Hanß Alexander, Schmid Maximilian, Liu E, Elger Gordon†
Transient thermal analysis as measurement method for IC package structural integrity |
|
Hanß Alexander, Schmid Maximilian, Liu E, Elger Gordon†
|
| 1-W high-power LED measured at different temperatures (25 °C and 55 °C) and different drive currents. The time derived curves have different amplitudes due to the different thermal loads. (a) One can notice that at 55 °C (red) with 350 mA drive current, less heat is generated than at 25 °C with 350 mA due to the drop of V f at higher temperature 55 °C (red). At 700 mA the amplitude of the signal is much larger. The two curves measured at 700 mA at the same temperature of 25 °C overlap fully (green and blue curves). (b) After normalization, all curves overlap perfectly because the heat flow in the sample is the same. At early times and very long times, the influence of noise is visible. This unit a.u. is the abbreviation for arbitrary unit. |
| |