Transient thermal analysis as measurement method for IC package structural integrity
Hanß Alexander, Schmid Maximilian, Liu E, Elger Gordon†
Transient thermal analysis as measurement method for IC package structural integrity |
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Hanß Alexander, Schmid Maximilian, Liu E, Elger Gordon†
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| The heat load is switched by the drive current of the LED. During heating up under high drive current V f decreases from the initial large value. Due to switching from a large drive current to a small sensing current V f is initially reduced because the required V f at lower current is smaller ( V ( I ) characteristic curve) and rises afterward while the junction cools down. |
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