Transient thermal analysis as measurement method for IC package structural integrity
Hanß Alexander, Schmid Maximilian, Liu E, Elger Gordon†
Transient thermal analysis as measurement method for IC package structural integrity |
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Hanß Alexander, Schmid Maximilian, Liu E, Elger Gordon†
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| Schematic drawing of a ceramic LED package on Al-IMS (a), test module (b), and footprint of LED package (c). |
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