Transient thermal analysis as measurement method for IC package structural integrity
Hanß Alexander, Schmid Maximilian, Liu E, Elger Gordon†
Transient thermal analysis as measurement method for IC package structural integrity |
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Hanß Alexander, Schmid Maximilian, Liu E, Elger Gordon†
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| Effects on the reliability of an LED module by failures like A: delamination of die bond, B: crack in solder joint, C: delamination of dielectric layer of Al-IMS. The cracks and delamination block the thermal path and the temperature increases. The changes in the heat flow path can be observed by transient thermal analysis. For a more detailed description of an LED package, see Fig. 2 . |
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