Transient thermal analysis as measurement method for IC package structural integrity
Hanß Alexander, Schmid Maximilian, Liu E, Elger Gordon†
Transient thermal analysis as measurement method for IC package structural integrity |
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Hanß Alexander, Schmid Maximilian, Liu E, Elger Gordon†
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| Weibull plot of Innolot ( R 2 = 0.7734) and SAC ( R 2 = 0.9784). Twenty-four of 40 samples were cycled to 1500 cycles. Red cross indicates 100% failure for both SAC and Innolot samples. |
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