Transient thermal analysis as measurement method for IC package structural integrity
Hanß Alexander, Schmid Maximilian, Liu E, Elger Gordon†
Transient thermal analysis as measurement method for IC package structural integrity |
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Hanß Alexander, Schmid Maximilian, Liu E, Elger Gordon†
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| Measurement deviation due to noise in the early time range. At 1 A and 0.5 A, the same LED module is measured. Cumulative [(a) and (d)] and derivative structural function [(b) and (e)] of R th_el and R th_real are shown. The logarithmic time deviation is depicted before and after normalization [(c) and (f)]. Due to normalization it is revealed that the heat flow through the LED module is identical for both conditions. However, due to the response of the temperature regulation device, differences are visible at 1 s. The larger noise at 0.5 A is visible on the time derivative curves but not on the structural functions. The effect of the noise is clearly visible in the center peak position in the derivative structural functions of R th_real. The difference of R th_el and R th_real is also pronounced. The R th_el of the 1-A measurement is larger due to the lower WPE at 1 A. However the measurement at 0.5 A has a higher tear-off edge due to the distortion of the active temperature regulation. |
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