Transient thermal analysis as measurement method for IC package structural integrity
Hanß Alexander, Schmid Maximilian, Liu E, Elger Gordon†
Transient thermal analysis as measurement method for IC package structural integrity |
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Hanß Alexander, Schmid Maximilian, Liu E, Elger Gordon†
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| Influence of the dead time extrapolation. (a) Logarithmic time derivation of a transient V f( t ) measurement of the LUXEON Altilon test package processed by “minimum seek 20 μs” (blue line) and “square root 20 μs–40 μs (red line).” (b) Influence of the dead time extrapolation on the structural function. (c) Influence on the derivative of the structural function (first derivation of the structural function d C /d R ). |
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